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AXA2R73061T Datasheet(PDF) 2 Page - Panasonic Semiconductor |
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AXA2R73061T Datasheet(HTML) 2 Page - Panasonic Semiconductor |
2 / 8 page AXA2R PRODUCT TYPES SPECIFICATIONS 1. Characteristics Note: *1. The above characteristics cannot be guaranteed when a card other than the specified ones is used. 2. Material and surface treatment Product name Eject type Card detection switch Card jump-out prevention function Mounting type Standoff height (mm) Part No. Packing quantity Inner carton Outer carton Sockets for SD memory card (R type) Push-push type Available Available Standard mounting type 0 AXA2R73061 ∗ Asterisk “ ∗ ” mark on end of Part No.; P: 350 pieces (1 reel) (Embossed tape package) T: 35 pieces (1 tray) (Tray package) Asterisk “ ∗ ” mark on end of Part No.; P: 700 pieces (2 reels) (Embossed tape package) T: 700 pieces (20 trays) (Tray package) 1. 5 AXA2R73361 ∗ Reverse mounting type 0 AXA2R63061 ∗ 1.5 AXA2R63361 ∗ Not available Standard mounting type 0 AXA2R73021 ∗ 1.5 AXA2R73321 ∗ Reverse mounting type 0 AXA2R63021 ∗ 1.5 AXA2R63321 ∗ Item Specifications Condition Electrical characteristics Rated Current 0.5 A/1 terminal Contact resistance Signal contact portion: Max. 100m Ω (Initial) Detection contact portion: Max. 150m Ω (Initial) (Card detection and write protection detection) Measured based on the HP4338B measurement method of JIS C5402 Insulation resistance Min. 1,000M Ω (Initial) Using 500V DC megger (applied for 1 min.) Breakdown voltage 500V AC for 1 min. Rated voltage is applied for one minute and check for short circuit or damage with a detection current of 1 mA. Mechanical characteristics Vibration resistance Frequency: 10 to 55 Hz Acceleration: 20.0 m/s2 {2.0G} No current interruption for more than 0.1 µs Card insertion force Max. 40N Card removal force Min. 1N, Max. 40N Lifetime characteristics Insertion and removal life of card Insertion and removal life: 10,000 times Contact resistance after testing: Signal contact portion: Max. 100m Ω Detection contact portion: Max. 150m Ω (Card detection and write protection detection) Insertion and removal speed are at a rate of 600 times/hour or less. Environmental characteristics Ambient temperature –25 °C to +90°C No freezing or condensation in low temperatures Storage temperature –40 °C to +90°C (The allowable storage temperature is –40°C to +50°C if unopened from original packaging) No freezing or condensation in low temperatures Resistance to soldering heat Reflow soldering: peak temperature 250 °C or less Hand soldering: Soldering iron temperature 300 °C, 5 sec. or less Sockets (shell) surface temperature for using infrared reflow soldering machine Humidity tolerance (mated condition) Contact resistance: Signal contact portion: Max. 100m Ω Detection contact portion: Max. 150m Ω (Card detection and write protection detection) Insulation resistance: Min. 100 M Ω MIL-STD-1344A, METHOD 1002 Temperature: 40 ±2°C, Humidity: 90 to 95%RH, Test time: 500 hours Applicable memory card SD memory card*1 Unit weight 2.9g Portion Material Surface Signal contact Copper alloy Contact portion: Ni plating on base, PdNi plating + Au flash plating Soldering portion: Ni plating on base, Au plating on surface Detection contact Contact/Soldering portion: Ni plating on base, Au plating on surface Retention solder tab Stainless steel Soldering portion: Ni strike, Partial Au plating panasonic-electric-works.net/ac To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009 |
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