industrial.panasonic.com/ac/e/

AXT5, 6

ACCTB29E 201303-T

SPECIFICATIONS

1. Characteristics

2. Material and surface treatment

Item

Specifications

Conditions

Electrical

characteristics

Rated current

0.3A/pin contact (Max. 5 A at total pin contacts)

Rated voltage

60V AC/DC

Breakdown voltage

150V AC for 1 min.

No short-circuiting or damage at a detection current of 1 mA

when the specified voltage is applied for one minute.

Insulation resistance

Min. 1,000M

Ω (initial)

Using 250V DC megger (applied for 1 min.)

Contact resistance

Max. 90m

Ω

Based on the contact resistance measurement method

specified by JIS C 5402.

Mechanical

characteristics

Composite insertion force

Max. 0.981N/pin contacts

× pin contacts (initial)

Composite removal force

Min. 0.165N/pin contacts

× pin contacts

Contact holding force

(Socket contact)

Min. 0.49N/pin contacts

Measuring the maximum force.

As the contact is axially pull out.

Environmental

characteristics

Ambient temperature

–55

°C to +85°C

No freezing at low temperatures. No dew condensation.

Soldering heat resistance

Peak temperature: 260

°C or less (on the surface of

the PC board around the connector terminals)

Infrared reflow soldering

300

°C within 5 sec. 350°C within 3 sec.

Soldering iron

Storage temperature

–55

°C to +85°C (product only)

–40

°C to +50°C (emboss packing)

No freezing at low temperatures. No dew condensation.

Thermal shock resistance

(header and socket mated)

5 cycles,

insulation resistance min. 100M

Ω,

contact resistance max. 90m

Ω

Conformed to MIL-STD-202F, method 107G

Humidity resistance

(header and socket mated)

120 hours,

insulation resistance min. 100M

Ω,

contact resistance max. 90m

Ω

Bath temperature 40

±2°C,

humidity 90 to 95% R.H.

Saltwater spray resistance

(header and socket mated)

24 hours,

insulation resistance min. 100M

Ω,

contact resistance max. 90m

Ω

Bath temperature 35

±2°C,

saltwater concentration 5

±1%

(header and socket mated)

48 hours,

contact resistance max. 90m

Ω

Bath temperature 40

±2°C, gas concentration 3±1 ppm,

humidity 75 to 80% R.H.

Lifetime

characteristics

Insertion and removal life

50 times

Repeated insertion and removal speed of max. 200 times/

hours

Unit weight

20 pin contact type: Socket: 0.03 g Header: 0.01 g

Part name

Material

Surface treatment

Molded

portion

LCP resin

(UL94V-0)

—

Contact and

Post

Copper alloy

Contact portion: Base: Ni plating Surface: Au plating

Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)

The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).

Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips)

Headers: Base: Ni plating Surface: Au plating (except the terminal tips)

Order Temperature (

°C)

Time (minutes)

1

2

3

4

–55

85

–55

0

−3

30

Max. 5

30

Max. 5

+3

0

0

−3