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AXT654124 Datasheet(PDF) 7 Page - Panasonic Semiconductor |
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AXT654124 Datasheet(HTML) 7 Page - Panasonic Semiconductor |
7 / 11 page Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ AXT5, 6 ACCTB29E 201303-T NOTES 1. For high resistance to drop impact the F4 series is recommended. 2. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. • Socket (Mated height: 1.0 mm) Recommended PC board pattern (TOP VIEW) Recommended metal mask pattern Metal mask thickness: When 150 µm (Terminal opening ratio: 48%) (Metal-part opening ratio: 100%) Recommended metal mask pattern Metal mask thickness: When 120 µm (Terminal opening ratio: 60%) (Metal-part opening ratio: 100%) • Header (Mated height: 1.0 mm) Recommended PC board pattern (TOP VIEW) Recommended metal mask pattern Metal mask thickness: When 150 µm (Terminal opening ratio: 48%) (Metal-part opening ratio: 100%) Recommended metal mask pattern Metal mask thickness: When 120 µm (Terminal opening ratio: 60%) (Metal-part opening ratio: 100%) : Insulation area 0.90 ±0.03 0.70 ±0.03 0.23 ±0.03 0.40 ±0.03 0.90 ±0.01 0.70 ±0.01 0.20 ±0.01 0.40 ±0.01 0.20 ±0.01 0.90 ±0.01 0.70 ±0.01 0.40 ±0.01 Please note that this inspection connector cannot be connected to standard models with a stacking height of 1.2 mm (AXT5 ∗∗224 and AXT6 ∗∗224). Please contact our sales office for a type connectable to models with a stacking height of 1.2 mm. Please refer to the latest product specifications when designing your product. 0.80 ±0.03 0.45 ±0.03 0.23 ±0.03 0.40 ±0.03 : Insulation area 0.80 ±0.01 0.45 ±0.01 0.20 ±0.01 0.40 ±0.01 0.20 ±0.01 0.80 ±0.01 0.45 ±0.01 0.40 ±0.01 |
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