MFU Series

www.vishay.com

Vishay Beyschlag

Revision: 11-Mar-13

11

Document Number: 28747

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

TEST AND REQUIREMENTS

All tests are carried out in accordance with the following

specifications:

IEC 60127-1, Miniature fuse - Part 1:

Definitions for

miniature fuses and general requirements for miniature

fuse-links

IEC 60127-4, Universal Modular Fuse Links (UMF)

UL 248-14, Low voltage fuses - Part 14:

Supplemental

fuses

For the full test schedule refer to the documents listed

above. The testing also covers most of the requirements

specified by METI and CCC.

The tests are carried out under standard atmospheric

conditions in accordance with IEC 60068-1, 5.3. Climatic

category LCT/UCT/56 (rated temperature range:

Lower

category temperature, upper category temperature; damp

heat, long term, 56 days) is valid.

Unless otherwise specified the following values apply:

Temperature: 15 °C to 35 °C

Relative humidity: 45 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).

The components are mounted for testing on printed-circuit

boards in accordance with IEC 60127-4, unless otherwise

specified.

The requirements stated in the Test Procedures and

Requirements table are based on the required tests and

permitted

limits

of

IEC

60127-1

and

IEC

60127-4

respectively. However, some additional tests and a number

of improvements against those minimum requirements have

been included.

TEST PROCEDURES AND REQUIREMENTS

IEC

60127-4

CLAUSE

IEC

60068-2

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE

8.3.2

Substrate

bending

Depth 1 mm;

rate 1 mm/s

1 times

No visible damage

R/R  ± 10 %

8.6.2

58 (Td)

Solderability

Solder bath method; SnPb40;

non-activated flux;

(215 ± 3) °C; (3 ± 0.3) s

Good tinning (

95 % covered);

no visible damage

Solder bath method; SnAg3Cu0.5 or SnAg3.5;

non-activated flux;

(245 ± 3) °C; (2 ± 0.2) s

8.7.2

58 (Td)

Resistance to

soldering heat

Solder bath method;

(260 ± 5) °C; (10 ± 1) s

No visible damage

R/R  ± 10 %

Reflow method 2

(IR/forced gas convection);

(260 ± 5) °C; (10 ± 1) s

9.2.1

-

Time/current

characteristics

at nominal

temperature

destructive testing under

overcurrent conditions

(DC-Current)

MFU 0402

MFU 0402

0.8 A

 I

MFU 0603

MFU 0805

MFU 1206

9.3.2

-

Breaking

capacity

50 A at rated voltage

acc. to UL 248-14

Optical inspection with naked eye

no visible damage

9.3.3

-

Residual

resistance

50 A at rated voltage

acc. to UL 248-14

Insulation resistance

higher than 0.1 M

