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ECJ0EC1H121 Datasheet(PDF) 4 Page - Panasonic Semiconductor |
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ECJ0EC1H121 Datasheet(HTML) 4 Page - Panasonic Semiconductor |
4 / 12 page – EC11 – Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Multilayer Ceramic Capacitors(For General Usage) 20 45 ±245±2 Unit : mm R340 Item Specification Test Method Class 1 Class 2 Bending Strength Appearance: No mechanical damage Capacitance change: Within ±5 % or ±0.5 pF whichever is larger. Appearance: No mechanical damage Capacitance change: Temp. Char. B, X7R, X5R : within ±12.5 % F ,Y5V : within ±30 % Bending value:1 mm Bending speed:1 mm/ Vibration Proof Appearance: No mechanical damage. Capacitance: within the specified tolerance Q, tan δ: Initial standard value Total amplitude : 1.5 mm Vibration frequency : 10 to 55 to 10 Hz for 1 min. 3 perpendicular directions for 2 hours each, a total of 6 hours Resistance to Soldering Heat Appearance: No mechanical damage Capacitance change: Within ±2.5 % or ±0.25 pF whichever is larger. Q.tan δ:Initial standard value IR:Initial standard value Withstand voltage: No dielectric breakdown and/or damage Appearance: No mechanical damage Capacitance change: Temp. Char. B, X7R, X5R : within ±7.5 % F, Y5V : within ±20 % tan δ:Initial standard value IR:Initial standard value Withstand voltage: No dielectric breakdown and/or damage Soldering bath method Preconditioning:Heat treatment/Class 2 ( ✽1) Solder temperature:270±5 °C Dipping period:3.0±0.5 s Preheat condition: Order Temp. (°C) Size 0805 max. 180 to 100 120 to 180 s 2150 to 200 120 to 180 s Recovery (Standard condition): Class 1:24±2 h Class 2:48±4 h Solderability More than 95 % of the soldered area of both terminal electrodes should be covered with fresh solder. Soldering bath method Solder temperature:230±5 °C Dipping period:4±1 s Solder:H63A (JIS Z 3282) Temperature Cycle Appearance: No mechanical damage Capacitance change: Within ±2.5 % or ±0.25 pF whichever is larger. Q.tan δ:Initial standard value IR:Initial standard value Withstand voltage: No dielectric breakdown and/or damage Appearance: No mechanical damage Capacitance change: Temp. Char. B, X7R, X5R : within ±7.5 % F, Y5V : within ±20 % tan δ:Initial standard value IR:Initial standard value Withstand voltage: No dielectric breakdown and/or damage Preconditioning:Heat treatment (150 °C, 1h) /Class 2 Condition of one cycle Step 1:Minimum operationing temp. 30±3 min Step 2:Room temp. 3 min max. Step 3:Maximum operationing temp. 30±3 min Step 4:Room temp. 3 min max. Number of cycles:5 cycles Recovery (Standard condition) Class 1:24±2 h Class 2:48±4 h Damp Heat (Steady state) Appearance: No mechanical damage Capacitance change: Within ±5 % or ±0.5 pF whichever is larger. Q: C<10 pF:Q >200+10C 10 pF <C<30 pF:Q>275+5C/2 30 pF <C<1000 pF:Q>350 tan δ: C>1000 pF:tan δ<0.004 C:Nominal capacitance in pF IR: 1000 M or 50/C (M ) Whichever is less. C:Nominal capacitance in µF Appearance: No mechanical damage Capacitance change: Temp. Char. B, X7R, X5R: Within ±20 % F, Y5V: Within ±30 % tan δ: Temp. Char. B, X7R, X5R: 0.25 max. F, Y5V: 0.3 max. IR: 1000 M or 50/C (M ) Whichever is less. Note:10/C (M ) min. for DC 10 V max. C:Nominal capacitance in µF Please see the technical specifications for details. Preconditioning:Heat treatment/Class 2 ( ✽1) Temperature:40±2 °C Relative humidity:90 to 95 % Test period:500+24/0 h Recovery (Standard condition) Class 1:24±2 h Class 2:48±4 h ( ✽1) Heat treatment: 1 h of heat treatment at 150 +0/-10 °C followed by 48±4 h recovery under standard conditions. Sep. 2008 00 |
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