MCIMX6Q6CYM08AC datasheet(1/165 Pages) FREESCALE

Part #	MCIMX6Q6CYM08AC

Description	i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors

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Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: IMX6DQAEC

Rev. 2.3, 07/2013

Package Information

Case FCPBGA 21 x 21 mm, 0.8 mm pitch

Ordering Information

See Table 1 on page 3

MCIMX6QxAxxxxC

MCIMX6DxAxxxxC

1

Introduction

The i.MX 6Dual and i.MX 6Quad automotive and

infotainment processors represent Freescale

Semiconductor’s latest achievement in integrated

multimedia applications processors. These processors

are part of a growing family of multimedia-focused

products that offer high-performance processing with a

high degree of functional integration. These processors

target the needs of the growing automotive infotainment,

telematics, HMI, and display-based cluster markets.

The i.MX 6Dual/6Quad processors feature Freescale’s

advanced implementation of the quad

ARM® Cortex®-A9 core, which operates at speeds up to

1 GHz. They include 2D and 3D graphics processors, 3D

1080p video processing, and integrated power

management. Each processor provides a 64-bit

DDR3/LVDDR3/LPDDR2-1066 memory interface and

a number of other interfaces for connecting peripherals,

such as WLAN, Bluetooth®, GPS, hard drive, displays,

and camera sensors.

i.MX 6Dual/6Quad

Automotive and

Infotainment

Applications Processors

1

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

1.3

Updated Signal Naming Convention . . . . . . . . . . . . 7

2

Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3

Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1

Special Signal Considerations. . . . . . . . . . . . . . . . 17

3.2

Recommended Connections for Unused Analog

Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4

Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 18

4.1

Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 18

4.2

Power Supplies Requirements and Restrictions . . 30

4.3

Integrated LDO Voltage Regulator Parameters . . . 31

4.4

PLL Electrical Characteristics . . . . . . . . . . . . . . . . 33

4.5

On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 35

4.6

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 36

4.7

I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 40

4.8

Output Buffer Impedance Parameters . . . . . . . . . . 45

4.9

System Modules Timing . . . . . . . . . . . . . . . . . . . . 49

4.10 General-Purpose Media Interface (GPMI) Timing. 65

4.11 External Peripheral Interface Parameters . . . . . . . 74

5

Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 139

5.1

Boot Mode Configuration Pins. . . . . . . . . . . . . . . 139

5.2

Boot Devices Interfaces Allocation . . . . . . . . . . . 140

6

Package Information and Contact Assignments . . . . . . 142

6.1

Updated Signal Naming Convention . . . . . . . . . . 142

6.2

21 x 21 mm Package Information . . . . . . . . . . . . 142

7

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164

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