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BU1JTD3WG-TR Datasheet(PDF) 8 Page - Rohm |
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BU1JTD3WG-TR Datasheet(HTML) 8 Page - Rohm |
8 / 10 page www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0RBR0A300030-1-2 TSZ22111・15・001 8/10 30.JUL.2013.Rev.002 BUxxTD3WG series Datasheet About power dissipation (Pd) As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (PMAX) PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current) Measurement conditions Standard ROHM Board Layout of Board for Measurement IC Implementation Position Top Layer (Top View) Bottom Layer (Top View) Measurement State With board implemented (Wind speed 0 m/s) Board Material Glass epoxy resin (Double-side board) Board Size 70 mm x 70 mm x 1.6 mm Wiring Rate Top layer Metal (GND) wiring rate: Approx. 0% Bottom layer Metal (GND) wiring rate: Approx. 50% Through Hole Diameter 0.5mm x 6 holes Power Dissipation 0.54W Thermal Resistance θja=185.2°C/W * Please design the margin so that PMAX becomes is than Pd (PMAX <Pd) within the usage temperature range Fig. 28 SSOP5 Power dissipation heat reduction characteristics (Reference) 0 0.1 0.2 0.3 0.4 0.5 0.6 0 25 50 75 100 125 Ta [℃] 0.54W 85 Standard ROHM Board |
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