PBSS4560PA

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Product data sheet

Rev. 1 — 19 May 2010

11 of 15

NXP Semiconductors

PBSS4560PA

11. Soldering

Reflow soldering is the only recommended soldering method.

Fig 17. Reflow soldering footprint SOT1061 (HUSON3)

occupied area

solder paste = solder lands

Dimensions in mm

sot1061_fr

solder resist

0.4

2.1

1.3

0.25

0.25

0.25

1.1

1.2

0.55

0.6

2.3

0.5 (2

×)

0.5 (2

×) 0.6 (2×)

0.4 (2

×)

0.5

1.6

1.7

1.05