Assembly Instructions for SCA6x0 and SCA10x0 series

TN71

VTI Technologies Oy

11/12

www.vti.fi

Rev.1.0

Remove the solder from the PCB using either a solder vacuum or solder braid making sure to clean

the area of solder thoroughly.

Figure 15.

Soldering iron and solder braid used for solder removal.

Note that the performance and the reliability of the reworked component may have

decreased due to the rework operation! VTI does not recommend rework.

8

Environmental Aspects

VTI Technologies respects environmental values and thus, its DIL packages are lead-free and

RoHS compatible. VTI Technologies’ sensors should be soldered with lead-free solders in order to

guarantee full RoHS compatibility.

9

References

JEDEC / Electronic Industries Alliance, Inc. Moisture/ReflowSensitivity Classification for Non-

Hermetic Solid State Surface Mount Devices (J-STD-020C).

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

(IPC/JEDEC J-STD-033).

Figure 13.

Tool head is carefully pressed

around component and kept in this

position for few seconds.

Figure 14.

Immediately after solder

melting, component is this lifted.