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EXBD16P103J Datasheet(PDF) 1 Page - Panasonic Semiconductor

Part # EXBD16P103J
Description  Chip Resistor Networks High speed mounting using conventional placing machine
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Manufacturer  PANASONIC [Panasonic Semiconductor]
Direct Link  http://www.panasonic.com/industrial/
Logo PANASONIC - Panasonic Semiconductor

EXBD16P103J Datasheet(HTML) 1 Page - Panasonic Semiconductor

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Chip Resistor Networks
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
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Product Code
Thick Film
Resistor
Network
Number of
Terminals
10(EXBD,E,A)
16(EXBQ)
Circuit Configuration
Code
C
Common Terminal Position
The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeros
following.
Resistance Value
Resistance
Tolerance
J
Suffix for Special
Requirements
Dimension Code of
Chip Resistor Network
Type: inches
Dimensions
4.0 mm 2.1 mm
6.4 mm 3.1 mm
3.8 mm 1.6 mm
P
P
E
Center common circuit
(EXBD, EXBE)
Diagonal common circuit
(Terminal 5 and Terminal 10)
(EXBA)
D : 1206
E : 1608
A : 2512
Q : 1506
3.2 mm 1.6 mm
One side common circuit
(Terminal 16)
(EXBQ)
Diagonal common circuit
(Terminal 1 and Terminal 6)
(EXBA)
±5 %
No through hole
Through holes
Pull up resistors
0.4 mm pitch
0.635 mm pitch
EXBE10C
EXBA10P
Direct placement on the bus line
IC
IC
VCC
IC
IC
VCC
IC
IC
VCC
<High density placing>
Chip Resistor Networks
Type:
EXBD:1206
EXBE:1608
EXBA:2512
EXBQ:1506
Explanation of Part Numbers
Features
● High density placing for digital signal circuits
· Bussed 8 or 15 resistors for pull up/down circuits
EXBD:
3.2 mm
× 1.6 mm × 0.55 mm, 0.635 mm pitch
EXBE:
4.0 mm
× 2.1 mm × 0.55 mm, 0.8 mm pitch
EXBA:
6.4 mm
× 3.1 mm × 0.55 mm, 1.27 mm pitch
EXBQ:
3.8 mm
× 1.6 mm × 0.45 mm, 0.5 mm pitch
· Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB
(“High density placing” is shown below)
● High speed mounting using conventional placing machine
● Reference Standard…IEC 60115-9, JIS C 5201-9, EIAJ RC-2130
● RoHS compliant
■ Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions
Please see Data Files
Aug. 2012
01
36


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