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AUIRFR4615TRL Datasheet(PDF) 2 Page - International Rectifier

Part # AUIRFR4615TRL
Description  Advanced Process Technology Low On-Resistance
Download  13 Pages
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Manufacturer  IRF [International Rectifier]
Direct Link  http://www.irf.com
Logo IRF - International Rectifier

AUIRFR4615TRL Datasheet(HTML) 2 Page - International Rectifier

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AUIRFR/U4615
2
www.irf.com
S
D
G
Notes:
 Repetitive rating; pulse width limited by max. junction
temperature.
‚ Limited by TJmax, starting TJ = 25°C, L = 0.51mH
RG = 25Ω, IAS = 21A, VGS =10V. Part not recommended for use
above this value .
ƒ ISD ≤ 21A, di/dt ≤ 549A/μs, VDD ≤ V(BR)DSS, TJ ≤ 175°C.
„ Pulse width ≤ 400μs; duty cycle ≤ 2%.
… Coss eff. (TR) is a fixed capacitance that gives the same charging time
as Coss while VDS is rising from 0 to 80% VDSS.
† Coss eff. (ER) is a fixed capacitance that gives the same energy as
Coss while VDS is rising from 0 to 80% VDSS.
‡ When mounted on 1" square PCB (FR-4 or G-10 Material). For recom
mended footprint and soldering techniques refer to application
note #AN-994
ˆ Rθ is measured at TJ approximately 90°C
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
V(BR)DSS
Drain-to-Source Breakdown Voltage
150
–––
–––
V
ΔV(BR)DSS/ΔTJ Breakdown Voltage Temp. Coefficient
–––
0.19
––– V/°C
RDS(on)
Static Drain-to-Source On-Resistance
–––
34
42
VGS(th)
Gate Threshold Voltage
3.0
–––
5.0
V
gfs
Forward Transconductance
35
–––
–––
S
IDSS
Drain-to-Source Leakage Current
–––
–––
20
–––
–––
250
IGSS
Gate-to-Source Forward Leakage
–––
–––
100
Gate-to-Source Reverse Leakage
–––
–––
-100
RG(int)
Internal Gate Resistance
–––
2.7
–––
Ω
Dynamic @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Qg
Total Gate Charge
–––
26
Qgs
Gate-to-Source Charge
–––
8.6
–––
Qgd
Gate-to-Drain ("Miller") Charge
–––
9.0
–––
Qsync
Total Gate Charge Sync. (Qg - Qgd)
–––
17
–––
td(on)
Turn-On Delay Time
–––
15
–––
tr
Rise Time
–––
35
–––
td(off)
Turn-Off Delay Time
–––
25
–––
tf
Fall Time
–––
20
–––
Ciss
Input Capacitance
–––
1750
–––
Coss
Output Capacitance
–––
155
–––
Crss
Reverse Transfer Capacitance
–––
40
–––
Coss eff. (ER) Effective Output Capacitance (Energy Related)
–––
179
–––
Coss eff. (TR) Effective Output Capacitance (Time Related)
–––
382
–––
Diode Characteristics
Parameter
Min. Typ. Max. Units
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode)
Ù
VSD
Diode Forward Voltage
–––
–––
1.3
V
trr
Reverse Recovery Time
–––
70
–––
TJ = 25°C
VR = 100V,
–––
83
–––
TJ = 125°C
IF = 21A
Qrr
Reverse Recovery Charge
–––
177
–––
TJ = 25°C
di/dt = 100A/μs
f
–––
247
–––
TJ = 125°C
IRRM
Reverse Recovery Current
–––
4.9
–––
A
TJ = 25°C
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
ns
nC
33
140
μA
nA
nC
ns
pF
A
–––
–––
–––
–––
ID = 21A
RG = 7.3Ω
VGS = 10V f
VDD = 98V
ID = 21A, VDS =0V, VGS = 10V
TJ = 25°C, IS = 21A, VGS = 0V f
integral reverse
p-n junction diode.
Conditions
VGS = 0V, ID = 250μA
Reference to 25°C, ID = 5mA™
VGS = 10V, ID = 21A f
VDS = VGS, ID = 100μA
VDS = 150V, VGS = 0V
VDS = 150V, VGS = 0V, TJ = 125°C
MOSFET symbol
showing the
VDS = 75V
Conditions
VGS = 10V f
VGS = 0V
VDS = 50V
ƒ = 1.0MHz
(See Fig.5)
VGS = 0V, VDS = 0V to 120V h(See Fig.11)
VGS = 0V, VDS = 0V to 120V g
Conditions
VDS = 50V, ID = 21A
ID = 21A
VGS = 20V
VGS = -20V


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