REVISION HISTORY

P/N

Rev

Date

Description of Change

DS8591

F

06/21/11

Updated pad & heat-sink dimensions on 16-pin plastic chip-scale (QFN) package to reflect

current package vendor's dimensions.

G

08/03/12

Updated VIL/VIH specification, Solder Temperature, and package dimensions (8PS, 16PC).

H

03/13/13

Clarify ARINC input resistance and correct error in RDIFF. Clarify solder temperature in

Absolute Maximum Ratings. Clarify operating temperature range in Recommended

Operating Conditions.

HOLT INTEGRATED CIRCUITS

6

HI-8591