UCC28740

SLUSBF3A – JULY 2013 – REVISED JULY 2013

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE

PINS

ORDERABLE

MINIMUM SWITCHING

OPTIONS

DEVICES

FREQUENCY (Hz)

SOIC (D)

7

UCC28740D

170

(1)

See Orderable Addendum for specific device ordering information.

ABSOLUTE MAXIMUM RATINGS

(1)

MIN

MAX

UNIT

Start-up pin voltage, HV

700

V

Bias supply voltage, VDD

38

Continuous gate-current sink

50

Continuous gate-current source

Self-limiting

mA

Peak current, VS

1

Peak current, FB

−1.2

Gate-drive voltage at DRV

−0.5

Self-limiting

CS

−0.5

5

V

Voltage range

FB

−0.5

7

VS

−0.75

7

Operating junction temperature range

−55

150

Storage temperature

−65

150

°C

Lead temperature 0.6 mm from case for 10 seconds

260

Human-body model (HBM)

2000

ESD rating

V

Charged-device model (CDM)

500

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages

are with respect to GND. Currents are positive into, negative out of the specified terminal. These ratings apply over the operating

ambient temperature ranges unless otherwise noted.

2

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