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HI-8201PCM Datasheet(PDF) 9 Page - Holt Integrated Circuits |
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HI-8201PCM Datasheet(HTML) 9 Page - Holt Integrated Circuits |
9 / 10 page HOLT INTEGRATED CIRCUITS 9 HI-8200 PACKAGE DIMENSIONS 16-PIN PLASTIC CHIP-SCALE PACKAGE millimeters Package Type: 16PCS1 BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) Top View Bottom View Electrically isolated metal heat sink on bottom of package Connect to any ground or power plane for optimum thermal dissipation 5.00 ± 0.05 (0.197 ± 0.002) 3.38 ± 0.05 (0.133 ± 0.002) 0.75 ± 0.05 (0.03 ± 0.002) 0.025 ± 0.025 (0.001 ± 0.001) 0.203 (0.008) REF. 0.80 (0.031) BSC 0.30 0.012 ± 0.05 ( ± 0.002) .50 ± 0.05 (0.020 ± 0.002) 0.20 (0.008) min. inches (millimeters) Package Type: 20HS BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) 20-PIN PLASTIC TSSOP 0° to 8° Pin 1 .0095 ± .0025 (.245 ± .055) .2555 ± .0035 (6.500 ± .100) .173 ± .004 (4.400 ± .100) .006 ± .002 (.145 ± .055) .036 ± .005 (.925 ± .125) .004 ± .002 (.100 ± .050) .018 - .029 (.450 - .750) .252 ± .006 (6.400 ± .150) Detail A See Detail A .026 (.650) BSC |
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