HI-8570, HI-8571

Legend: ESOIC - Thermally Enhanced Small Outline Package (SOIC) with built-in heat sink

ORDERING INFORMATION

HI - 857x xx x x

37.5 Ohms

0

27.5 Ohms

10 Ohms

PART

NUMBER

8570

8571

OUTPUT SERIES RESISTANCE

BUILT-IN

REQUIRED EXTERNALLY

PACKAGE

DESCRIPTION

8 PIN PLASTIC DIP (8P)

8 PIN PLASTIC NARROW BODY ESOIC (8HNE)

8 PIN CERDIP (8D) not available Pb-free

PART

NUMBER

PD

PS

CR

TEMPERATURE

RANGE

FLOW

BURN

IN

-40°C TO +85°C

No

I

-55°C TO +125°C

-55°C TO +125°C

No

Yes

T

M

PART

NUMBER

T

M

I

PART

NUMBER

LEAD

FINISH

100% Matte Tin (Pb-free, RoHS compliant)

F

Tin / Lead (Sn / Pb) Solder

Blank

HOLT INTEGRATED CIRCUITS

6