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ERBRE0R50V Datasheet(PDF) 4 Page - Panasonic Semiconductor |
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ERBRE0R50V Datasheet(HTML) 4 Page - Panasonic Semiconductor |
4 / 5 page – 391 – Micro Chip Fuse Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. C A B Preheating Peak Heating Time The following are precautions for individual products. Please also refer to the common precautions shown on page 4 of this catalog. 1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses) under normal conditions is within 70% of the rated current. 2. Do not continuously pass a current exceeding the rated current through the fuses. 3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take care not to cause unwanted fusing. Calculate the I 2t value of the pulse and check the tolerance to the number of pulses according to the I 2t-t characteristic curve before deciding to use the fuses. Before checking the tolerance, consult our sales staff in advance. 4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure that the abnormal current generated when a circuit abnormality occurs in your product is at least double or greater than the rated current of the fuses. In addition, ensure that the abnormal current of your product does not exceed the maximum interrupting current of the fuses. 5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary side. 6. Ensure that the voltage applied to the fuses are within their rated voltage. 7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses on your products and carefully check and evaluate their category temperature range. Safety Precautions ■ Recommended Land Pattern <Repair with hand soldering> ● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder each electrode for 3 seconds or less. ● Never touch this product with the tip of a soldering iron. Type (inch size) Dimensions (mm) AB C ERBRD(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 ERBRE(0603) 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0 ERBRG(1206) 2.0 to 2.4 4.4 to 5.0 1.2 to 1.8 Temperature Time Preheating 140 °C to 160 °C 60 s to 120 s Main heating Above 200 °C 30 s to 40 s Peak 235 ± 5 °C max. 10 s Temperature Time Preheating 150 °C to 180 °C 60 s to 120 s Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s For soldering For lead-free soldering Temperature TimeTemperature Time Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for reflow For soldering (Example : Sn/Pb) For lead-free soldering (Example : Sn/Ag/Cu) ● Recommended soldering conditions for flow · Reflow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specified. · Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. Sep. 2010 00 |
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