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CHA6252-QFG20 Datasheet(PDF) 3 Page - United Monolithic Semiconductors |
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CHA6252-QFG20 Datasheet(HTML) 3 Page - United Monolithic Semiconductors |
3 / 12 page 13-15.5GHz Power Amplifier CHA6252-QFG Ref. : DSCHA6252-QFG2355 - 20 Dec 12 3/12 Specifications subject to change without notice Bat. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Device thermal performances All the figures given in this section are obtained assuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the Tcase temperature cannot be maintained below the maximum temperature specified (see the curve Pdiss. Max) in order to guarantee the nominal device life time (MTTF). Recommended max. junction temperature (Tj max) : 152 °C Junction temperature absolute maximum rating : 175 °C Max. continuous dissipated power (Pdiss. Max.) : 7.7 W => Pdiss. Max. derating above Tcase (1)= 85 °C : 115 mW/°C Junction-Case thermal resistance (Rth J-C) (2) : <8 °C/W Minimum Tcase operating temperature (3) : -40 °C Maximum Tcase operating temperature (3) : 85 °C Minimum storage temperature : -55 °C Maximum storage temperature : 150 °C (1) Derating at junctio n temperature co nstant = Tj max. (2) Rth J-C is calculated fo r a wo rst case co nsidering the ho t t e s t junc t io n o f the M M IC and all the devices biased. (3) Tcase=P ackage back side temperature measured under the die-attach-pad (see the drawing belo w). 6.4 DEVICE THERMAL SPECIFICATION : CHA6252-QFG 0 1 2 3 4 5 6 7 8 9 -50 -25 0 25 50 75 100 125 150 175 Tcase (°C) Pdiss. Max. @Tj <Tj max (W) Tcase Example: QFN 16L 3x3 Location of temperature reference point (Tcase) on package's bottom side |
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