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RJP1CS06DWA Datasheet(PDF) 3 Page - Renesas Technology Corp |
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RJP1CS06DWA Datasheet(HTML) 3 Page - Renesas Technology Corp |
3 / 4 page RJP1CS06DWT/RJP1CS06DWA Preliminary R07DS0829EJ0100 Rev.1.00 Page 3 of 3 Jan 23, 2013 Die Dimension Illustration Part of white Part of dotted line Part of gray Note 1. Note 2. The back of the chip is processed with Au evaporation. Note 3. Recognition, target and any other patterns which are not related to IGBT operation, may be changed without notice. Definition Al pattern Bonding area Final passivation 8.8 7.15 1.31 5.78 Emitter bonding pad (1) Emitter bonding pad (3) Emitter bonding pad (2) Gate bonding pad Unit: mm Ordering Information Orderable Part Number RJP1CS06DWA-80#W0 RJP1CS06DWT-80#X0 |
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