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HIN202ECPZ Datasheet(PDF) 3 Page - Intersil Corporation |
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HIN202ECPZ Datasheet(HTML) 3 Page - Intersil Corporation |
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3 / 22 page  3 FN4315.16 November 4, 2005 HIN208EIAZ (Note) HIN208EIAZ -40 to 85 24 Ld SSOP (Pb-free) M24.209 HIN208EIAZ-T (Note) HIN208EIAZ 24 Ld SSOP Tape and Reel (Pb-free) M24.209 HIN208EIB HIN208EIB -40 to 85 24 Ld SOIC M24.3 HIN208EIBZ (Note) HIN208EIBZ -40 to 85 24 Ld SOIC (Pb-free) M24.3 HIN211ECA HIN211ECA 0 to 70 28 Ld SSOP M28.209 HIN211ECA-T HIN211ECA 28 Ld SSOP Tape and Reel M28.209 HIN211ECAZ (Note) HIN211ECAZ 0 to 70 28 Ld SSOP (Pb-free) M28.209 HIN211ECAZ-T (Note) HIN211ECAZ 28 Ld SSOP Tape and Reel (Pb-free) M28.209 HIN211ECB HIN211ECB 0 to 70 28 Ld SOIC M28.3 HIN211ECBZ (Note) HIN211ECBZ 0 to 70 28 Ld SOIC (Pb-free) M28.3 HIN211ECBZ-T (Note) HIN211ECBZ 28 Ld SOIC Tape and Reel (Pb-free) M28.3 HIN211EIA HIN211EIA -40 to 85 28 Ld SSOP M28.209 HIN211EIA-T HIN211EIA 28 Ld SSOP Tape and Reel M28.209 HIN211EIAZ (Note) HIN211EIAZ -40 to 85 28 Ld SSOP (Pb-free) M28.209 HIN211EIAZ-T (Note) HIN211EIAZ 28 Ld SSOP Tape and Reel (Pb-free) M28.209 HIN211EIB HIN211EIB -40 to 85 28 Ld SOIC M28.3 HIN211EIBZ (Note) HIN211EIBZ -40 to 85 28 Ld SOIC (Pb-free) M28.3 HIN213ECA HIN213ECA 0 to 70 28 Ld SSOP M28.209 HIN213ECA-T HIN213ECA 28 Ld SSOP Tape and Reel M28.209 HIN213ECAZ (Note) HIN213ECAZ 0 to 70 28 Ld SSOP (Pb-free) M28.209 HIN213ECAZ-T (Note) HIN213ECAZ 28 Ld SSOP Tape and Reel (Pb-free) M28.209 HIN213EIA HIN213EIA -40 to 85 28 Ld SSOP M28.209 HIN213EIA-T HIN213EIA 28 Ld SSOP Tape and Reel M28.209 HIN213EIAZ (Note) HIN213EIAZ -40 to 85 28 Ld SSOP (Pb-free) M28.209 HIN213EIAZ-T (Note) HIN213EIAZ 28 Ld SSOP Tape and Reel (Pb-free) M28.209 HIN213EIB HIN213EIB -40 to 85 28 Ld SOIC M28.3 HIN213EIBZ (Note) HIN213EIBZ -40 to 85 28 Ld SOIC (Pb-free) M28.3 Ordering Information (Continued) PART NO. PART MARKING TEMP. RANGE (°C) PACKAGE PKG. DWG. # HIN232ECA HIN232ECA 0 to 70 16 Ld SSOP M16.209 HIN232ECA-T HIN232ECA 16 Ld SSOP Tape and Reel M16.209 HIN232ECAZ-T (Note) HIN232ECAZ 16 Ld SSOP Tape and Reel (Pb-free) M16.209 HIN232ECB HIN232ECB 0 to 70 16 Ld SOIC (W) M16.3 HIN232ECB-T HIN232ECB 16 Ld SOIC (W) Tape and Reel M16.3 HIN232ECBN HIN232ECBN 0 to 70 16 Ld SOIC (N) M16.15 HIN232ECBN-T HIN232ECBN 16 Ld SOIC (N) Tape and Reel M16.15 HIN232ECBNZ (Note) 232ECBNZ 0 to 70 16 Ld SOIC (N) (Pb-free) M16.15 HIN232ECBNZ-T (Note) 232ECBNZ 16 Ld SOIC (N) Tape and Reel (Pb-free) M16.15 HIN232ECBZ (Note) 232ECBZ 0 to 70 16 Ld SOIC (W) (Pb-free) M16.3 HIN232ECBZ-T (Note) 232ECBZ 16 Ld SOIC (W) Tape and Reel (Pb-free) M16.3 HIN232ECP HIN232ECP 0 to 70 16 Ld PDIP E16.3 HIN232ECPZ (Note) HIN232ECPZ 0 to 70 16 Ld PDIP* (Pb-free) E16.3 HIN232EIBN HIN232EIBN -40 to 85 16 Ld SOIC (N) M16.15 HIN232EIBN-T HIN232EIBN 16 Ld SOIC (N) Tape and Reel M16.15 HIN232EIBNZ (Note) 232EIBNZ -40 to 85 16 Ld SOIC (N) (Pb-free) M16.15 HIN232EIBNZ-T (Note) 232EIBNZ 16 Ld SOIC (N) Tape and Reel (Pb-free) M16.15 HIN232EIV HIN232EIV -40 to 85 16 Ld TSSOP M16.173 HIN232EIV-T HIN232EIV 16 Ld TSSOP Tape and Reel M16.173 HIN232EIVZ (Note) 232EIVZ -40 to 85 16 Ld TSSOP (Pb-free) M16.173 HIN232EIVZ-T (Note) 232EIVZ 16 Ld TSSOP Tape and Reel (Pb-free) M16.173 *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Ordering Information (Continued) PART NO. PART MARKING TEMP. RANGE (°C) PACKAGE PKG. DWG. # HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E |
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