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A2F060M3G-1PQ484YI Datasheet(PDF) 1 Page - Microsemi Corporation |
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A2F060M3G-1PQ484YI Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 192 page January 2013 I © 2013 Microsemi Corporation SmartFusion Customizable System-on-Chip (cSoC) Microcontroller Subsystem (MSS) • Hard 100 MHz 32-Bit ARM® Cortex™-M3 – 1.25 DMIPS/MHz Throughput from Zero Wait State Memory – Memory Protection Unit (MPU) – Single Cycle Multiplication, Hardware Divide – JTAG Debug (4 wires), Serial Wire Debug (SWD, 2 wires), and Single Wire Viewer (SWV) Interfaces • Internal Memory – Embedded Nonvolatile Flash Memory (eNVM), 128 Kbytes to 512 Kbytes – Embedded High-Speed SRAM (eSRAM), 16 Kbytes to 64 Kbytes, Implemented in 2 Physical Blocks to Enable Simultaneous Access from 2 Different Masters • Multi-Layer AHB Communications Matrix – Provides up to 16 Gbps of On-Chip Memory Bandwidth,1 Allowing Multi-Master Schemes • 10/100 Ethernet MAC with RMII Interface2 • Programmable External Memory Controller, Which Supports: – Asynchronous Memories – NOR Flash, SRAM, PSRAM – Synchronous SRAMs •Two I2C Peripherals • Two 16550 Compatible UARTs • Two SPI Peripherals • Two 32-Bit Timers • 32-Bit Watchdog Timer • 8-Channel DMA Controller to Offload the Cortex-M3 from Data Transactions • Clock Sources – 32 KHz to 20 MHz Main Oscillator – Battery-Backed 32 KHz Low Power Oscillator with Real-Time Counter (RTC) – 100 MHz Embedded RC Oscillator; 1% Accurate – Embedded Analog PLL with 4 Output Phases (0, 90, 180, 270) High-Performance FPGA • Based on proven ProASIC®3 FPGA Fabric • Low Power, Firm-Error Immune 130-nm, 7-Layer Metal, Flash-Based CMOS Process • Nonvolatile, Instant On, Retains Program When Powered Off • 350 MHz System Performance • Embedded SRAMs and FIFOs – Variable Aspect Ratio 4,608-Bit SRAM Blocks – x1, x2, x4, x9, and x18 Organizations – True Dual-Port SRAM (excluding x18) – Programmable Embedded FIFO Control Logic • Secure ISP with 128-Bit AES via JTAG • FlashLock® to Secure FPGA Contents • Five Clock Conditioning Circuits (CCCs) with up to 2 Integrated Analog PLLs – Phase Shift, Multiply/Divide, and Delay Capabilities – Frequency: Input 1.5–350 MHz, Output 0.75 to 350 MHz Programmable Analog Analog Front-End (AFE) • Up to Three 12-Bit SAR ADCs – 500 Ksps in 12-Bit Mode – 550 Ksps in 10-Bit Mode – 600 Ksps in 8-Bit Mode • Internal 2.56 V Reference or Optional External Reference • One First-Order DAC (sigma-delta) per ADC – 8-Bit, 16-Bit, or 24-Bit 500 Ksps Update Rate • Up to 5 High-Performance Analog Signal Conditioning Blocks (SCB) per Device, Each Including: – Two High-Voltage Bipolar Voltage Monitors (with 4 input ranges from ±2.5 V to –11.5/+14 V) with 1% Accuracy – High Gain Current Monitor, Differential Gain = 50, up to 14 V Common Mode – Temperature Monitor (Resolution = ¼°C in 12-Bit Mode; Accurate from –55°C to 150°C) • Up to Ten High-Speed Voltage Comparators (tpd =15ns) Analog Compute Engine (ACE) • Offloads Cortex-M3–Based MSS from Analog Initialization and Processing of ADC, DAC, and SCBs • Sample Sequence Engine for ADC and DAC Parameter Set-Up • Post-Processing Engine for Functions such as Low- Pass Filtering and Linear Transformation • Easily Configured via GUI in Libero® System-on-Chip (SoC) Software I/Os and Operating Voltage • FPGA I/Os – LVDS, PCI, PCI-X, up to 24 mA IOH/IOL – Up to 350 MHz • MSS I/Os – Schmitt Trigger, up to 6 mA IOH, 8 mA IOL – Up to 180 MHz • Single 3.3 V Power Supply with On-Chip 1.5 V Regulator • External 1.5 V Is Allowed by Bypassing Regulator (digital VCC = 1.5 V for FPGA and MSS, analog VCC = 3.3 V and 1.5 V) 1 Theoretical maximum 2 A2F200 and larger devices Revision 10 |
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