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MOC205M Datasheet(PDF) 9 Page - Fairchild Semiconductor |
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MOC205M Datasheet(HTML) 9 Page - Fairchild Semiconductor |
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9 / 10 page  ©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com MOC205M, MOC206M, MOC207M Rev. 1.0.2 9 Reflow Profile Profile Freature Pb-Free Assembly Profile Temperature Minimum (Tsmin) 150°C Temperature Maximum (Tsmax) 200°C Time (tS) from (Tsmin to Tsmax) 60–120 seconds Ramp-up Rate (tL to tP) 3°C/second maximum Liquidous Temperature (TL) 217°C Time (tL) Maintained Above (TL) 60–150 seconds Peak Body Package Temperature 260°C +0°C / –5°C Time (tP) within 5°C of 260°C 30 seconds Ramp-down Rate (TP to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum Time (seconds) Time 25°C to Peak 260 240 220 200 180 160 140 120 100 80 60 40 20 0 TL ts tL tP TP Tsmax Tsmin 120 Preheat Area Max. Ramp-up Rate = 3°C/S Max. Ramp-down Rate = 6°C/S 240 360 |
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