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Document Number 28528

324

Revision 13-Jan-06

2281 808 .....

Vishay BCcomponents

Ø 10 mm Film Dielectric Trimmers

22

Na

rapid change of temperature

1 cycle; 0.5 hours at lower and 0.5

hours at upper category

temperature

ΔC/C: ≤ 1.5 %

23

T

soldering:

Ta

solderability

solder bath immersion 3 mm;

235 °C; 2 s

good wetting

no mechanical damage

Tb

resistance to heat

solder bath: 260 °C; 10 s

no mechanical damage

24

Eb

impact bump

4000 ± 10 bumps; 40 g; 6 ms

ΔC/C: ≤ 0.4 %;

no mechanical damage

25

Fc

vibration

frequency 10 to 55 Hz;

amplitude 0.35 mm;

1.5 hours

ΔC/C: ≤ 0.8 %;

no mechanical damage

26

climatic sequence:

ΔC/C: ≤ 3 % for C

ΔC/C: ≤ 6 % for C

26.1

B

dry heat

16 hours at upper category

temperature

tan

tan

rotor contact R:

≤ 10

Ω

26.2

D

damp heat accelerated,

first cycle

1 cycle; 24 hours; + 40 °C;

95 to 100 % RH

voltage proof:

300 V for 1 minute

26.3

Aa

cold

16 hours; - 40 °C

visual examination:

no mechanical damage

26.5

damp heat accelerated,

remaining cycles

1 cycle; 24 hours; + 40 °C;

95 to 100 % RH

operating torque: 2 to 35 mNm

27

Ca

damp heat steady state

21 days; + 40 °C;

90 to 95 % RH

ΔC/C:

≤ 3 % for C

≤ 3 % for C

max

≥ 100 pF

tan

tan

rotor contact R:

≤ 10 m

Ω

voltage proof:

300 V for 1 minute

visual examination:

no mechanical damage

operating torque: 2 to 35 mNm

29

mechanical endurance

10 cycles

ΔC/C: ≤ 1 %

ΔC/C after axial thrust: ≤ 0.4 %;

rotor contact R:

≤ 10 m

Ω

voltage proof:

300 V for 1 minute

visual examination:

no mechanical damage

operating torque: 1.5 to 37 mNm

IEC

60418-1

CLAUSE

IEC 60068

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS