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MHSL15055 Datasheet(PDF) 2 Page - General Semiconductor |
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MHSL15055 Datasheet(HTML) 2 Page - General Semiconductor |
2 / 8 page 2 2 Tyco Electronics Corp. Technical Note July 1996 250 W—300 W Board-Mounted Power Modules Thermal Management for FC- and FW-Series Basic Thermal Management (continued) The goal of thermal management is to transfer the heat dissipated by the module to the surrounding environ- ment. The amount of power dissipated by the module as heat (PD) is the difference between the input power (PI) and the output power (Po) as shown by the equa- tion below: PD = PI – Po Also, module efficiency ( η) is defined as the ratio of output power to input power as shown by the equation below: η = Po / PI The input power term can be eliminated by the combi- nation of these two equations to yield the equation below: PD = Po (1 – η) / η This equation can be used to calculate the module power dissipation. However, efficiency is a nonlinear function of the module input voltage (VI) and output current (Io). Typically, a plot of power dissipation versus output current over three different line voltages is given in each module-specific data sheet. This is because each module has a different power dissipation curve. A typical curve of this type is shown below in Figure 2 for a FW300A1 Power Module (5 V output voltage). 8-1313 Figure 2. FW300A1 Power Dissipation vs. Output Current Module Derating Experimental Setup The derating curves in the following figures were obtained from measurements obtained in an experi- mental apparatus shown in Figure 3. Note that the module and the printed-wiring board (PWB) onto which it was mounted were vertically oriented. The passage has a rectangular cross-section. The clearance between the top of the module and the facing PWB was kept constant at 0.5 in. 8-690a Figure 3. Experimental Test Setup V = 72 V V = 54 V V = 36 V 70 60 50 40 30 20 10 0 0 102030 40 50 60 OUTPUT CURRENT, IO (A) FACING PWB AIR VELOCITY AND AMBIENT TEMPERATURE MEASURED HERE AIRFLOW PWB |
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