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MHST02555 Datasheet(PDF) 1 Page - General Semiconductor |
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MHST02555 Datasheet(HTML) 1 Page - General Semiconductor |
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1 / 8 page  Technical Note July 1996 Thermal Management for FC- and FW-Series 250 W—300 W Board-Mounted Power Modules Introduction Board-mounted power modules (BMPMs) enhance the capabilities of advanced computer and communi- cations systems by providing flexible power architec- tures; however, proper cooling of the power modules is required for reliable and consistent operation. Maintaining the operating case temperature (Tc) within the specified range keeps internal component temperatures within their specifications. This, in turn, helps keep the expected mean time between failures (MTBF) from falling below the specified rating. Tyco's FC- and FW- Series 250 W to 300 W BMPMs are designed with high efficiency as a primary goal. The 5 V output units have typical full load efficiencies of 83%, which result in less heat dissipation and lower operating temperatures. Also, these modules use temperature resistant components, such as ceramic capacitors, that do not exhibit wearout behavior during prolonged exposure to high tempera- tures, as do aluminum electrolytic capacitors. This application note provides the necessary infor- mation to verify that adequate cooling is present in a given operating environment. This information is applicable to all Tyco 250 W to 300 W BMPMs in the 4.6 in. x 2.4 in. x 0.5 in. package. Basic Thermal Management Proper cooling can be verified by measuring the case temperature of the module (Tc) at the location indi- cated in Figure 1. Note that the view in Figure 1 is of the metal surface of the module (the pin locations shown are for reference). Tc must not exceed 100 °C while operating in the final system configuration. After the module has reached thermal equilibrium, the measurement can be made with a thermocouple or surface probe. If a heat sink is mounted to the case, make the measurement as close as possible to the indicated position, taking into account the contact resistance between the mounting surface and the heat sink (see Heat Sink section). 8-1303a Figure 1. Case Temperature Measurement (Metal Side) While this is a valid method of checking for proper thermal management, it it is only usable if the final system configuration exists and can be used as a test environment. The graphs on the accompanying pages provide guidelines to predict the thermal per- formance of the module for typical configurations that include heat sinks in natural or forced airflow environ- ments. However, due to differences between the test setup and the final system environment, the module case temperature must always be checked in the final system configuration to verify proper operation. 1.20 (30.5) 3.25 (82.6) CASE SYNC IN VI(–) VI(+) VO(+) VO(–) SYNC OUT MEASURE CASE TEMPERATURE HERE ON/OFF |
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