Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Thick Film Chip Resistors

Chip Resistor

a

b

Preheating

Peak

Heating

Time

Type

(inches)

Dimensions (mm)

ab

c

ERJXG (01005)

0.15 to 0.20

0.5 to 0.7

0.20 to 0.25

ERJ1G (0201)

0.3 to 0.4

0.8 to 0.9

0.25 to 0.35

ERJ2G (0402)

0.5 to 0.6

1.4 to 1.6

0.4 to 0.6

ERJ3G (0603)

0.7 to 0.9

2 to 2.2

0.8 to 1

ERJ6G (0805)

1 to 1.4

3.2 to 3.8

0.9 to 1.4

ERJ8G (1206)

2 to 2.4

4.4 to 5

1.2 to 1.8

ERJ14(1210)

2 to 2.4

4.4 to 5

1.8 to 2.8

ERJ12 (1812)

3.3 to 3.7

5.7 to 6.5

2.3 to 3.5

ERJ12Z(2010)

3.6 to 4

6.2 to 7

1.8 to 2.8

ERJ1T(2512)

5 to 5.4

7.6 to 8.6

2.3 to 3.5

Temperature

Time

Preheating

140 °C to 160 °C

60 s to 120 s

Main heating

Above 200 °C

30 s to 40 s

Peak

235 ± 5 °C

max. 10 s

Temperature

Time

Preheating

150 °C to 180 °C

60 s to 120 s

Main heating

Above 230 °C

30 s to 40 s

Peak

max. 260 °C

max. 10 s

For soldering

For lead-free soldering

Temperature

Time

Temperature

Time

Preheating

140 °C to 180 °C

60 s to 120 s

150 °C to 180 °C

60 s to 120 s

Soldering

245 ± 5 °C

20 s to 30 s

max. 260 °C

max. 10 s

In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly.

Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflow soldering, solder

amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).

Recommendations and precautions are described below.

● Recommended soldering conditions for reflow

For soldering (Example : Sn/Pb)

For lead-free soldering (Example : Sn/Ag/Cu)

● Recommended soldering conditions for flow

· Reflow soldering shall be performed a maximum of

two times.

· Please contact us for additional information when

used in conditions other than those specified.

· Please measure the temperature of the terminals

and study every kind of solder and printed circuit

board for solderability before actual use.

Safety Precautions

The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors

shown on page ER3 of this catalog.

1. Take measures against mechanical stress during and after mounting of Thick Film Chip Resistors (hereafter called the

resistors) so as not to damage their electrodes and protective coatings.

2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations

of the resistors when installed in your products before use.

Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.

3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance

and/or reliability.

4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a

soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).

5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing

problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.

6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'

protective coatings and bodies may be chipped, affecting their performance.

7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.

Mar. 2005