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RJP65S05DWA-80W0 Datasheet(PDF) 3 Page - Renesas Technology Corp |
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RJP65S05DWA-80W0 Datasheet(HTML) 3 Page - Renesas Technology Corp |
3 / 4 page RJP65S05DWT/RJP65S05DWA Preliminary R07DS0822EJ0002 Rev.0.02 Page 3 of 3 Aug 09, 2012 Die Dimension Illustration Part of white Part of dotted line Part of gray Note 1. Note 2. The back of the chip is processed with Au evaporation. Note 3. Recognition, target and any other patterns which are not related to IGBT operation, may be changed without notice. Definition Al pattern Bonding area Final passivation 7.0 5.66 1.31 4.29 Emitter bonding pad (1) Emitter bonding pad (3) Emitter bonding pad (2) Gate bonding pad Unit: mm Ordering Information Orderable Part Number RJP65S05DWA-80#W0 RJP65S05DWT-80#X0 |
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