CYStech Electronics Corp.

Spec. No. : C322S3

Issued Date : 2013.08.29

Revised Date : 2013.09.09

Page No. : 7/8

MTP2301S3

CYStek Product Specification

Recommended wave soldering condition

Peak Temperature

Soldering Time

Product

Pb-free devices

260 +0/-5

°C

5 +1/-1 seconds

Recommended temperature profile for IR reflow

Profile feature

Sn-Pb eutectic Assembly

Pb-free Assembly

Average ramp-up rate

(Tsmax to Tp)

3

°C/second max.

3

°C/second max.

Preheat

100

°C

150

°C

60-120 seconds

150

°C

200

°C

60-180 seconds

Time maintained above:

183

°C

60-150 seconds

217

°C

60-150 seconds

240 +0/-5

°C

260 +0/-5

°C

Time within 5

°C of actual peak

10-30 seconds

20-40 seconds

temperature(tp)

Ramp down rate

6

°C/second max.

6

°C/second max.

Time 25

°C to peak temperature

6 minutes max.

8 minutes max.

Note : All temperatures refer to topside of the package, measured on the package body surface.