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IS46TR82560A-15HBLA2 Datasheet(PDF) 7 Page - Integrated Silicon Solution, Inc

Part # IS46TR82560A-15HBLA2
Description  256Mx8, 128Mx16 2Gb DDR3 SDRAM
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Manufacturer  ISSI [Integrated Silicon Solution, Inc]
Direct Link  http://www.issi.com
Logo ISSI - Integrated Silicon Solution, Inc

IS46TR82560A-15HBLA2 Datasheet(HTML) 7 Page - Integrated Silicon Solution, Inc

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IS43/46TR16128A, IS43/46TR16128AL,
IS43/46TR82560A, IS43/46TR82560AL
Integrated Silicon Solution, Inc.
– www.issi.com –
7
Rev. B1
8/08/2013
2.2 RESET and Initialization Procedure
2.2.1 Power-up Initialization Sequence
The following sequence is required for POWER UP and Initialization.
1. Apply power (RESET# is recommended to be maintained below 0.2 x VDD; all other inputs may be undefined).
RESET# needs to be maintained for minimum 200 us with stable power. CKE is pulled “Low” anytime before
RESET# being de-asserted (min. time 10 ns). The power voltage ramp time between 300mV to VDD(min) must be
no greater than 200 ms; and during the ramp, VDD > VDDQ and (VDD - VDDQ) < 0.3 volts.
VDD and VDDQ are driven from a single power converter output, AND
The voltage levels on all pins other than VDD, VDDQ, VSS, VSSQ must be less than or equal to VDDQ and VDD
on one side and must be larger than or equal to VSSQ and VSS on the other side. In addition, VTT is limited to
0.95 V max once power ramp is finished, AND
Vref tracks VDDQ/2.
OR
Apply VDD without any slope reversal before or at the same time as VDDQ.
Apply VDDQ without any slope reversal before or at the same time as VTT & Vref.
The voltage levels on all pins other than VDD, VDDQ, VSS, VSSQ must be less than or equal to VDDQ and VDD
on one side and must be larger than or equal to VSSQ and VSS on the other side.
2. After RESET# is de-asserted, wait for another 500 us until CKE becomes active. During this time, the DRAM will
start internal state initialization; this will be done independently of external clocks.
3. Clocks (CK, CK#) need to be started and stabilized for at least 10 ns or 5 tCK (which is larger) before CKE goes
active. Since CKE is a synchronous signal, the corresponding set up time to clock (tIS) must be met. Also, a NOP or
Deselect command must be registered (with tIS set up time to clock) before CKE goes active. Once the CKE is
registered “High” after Reset, CKE needs to be continuously registered “High” until the initialization sequence is
finished, including expiration of tDLLK and tZQinit.
4. The DDR3 SDRAM keeps its on-die termination in high-impedance state as long as RESET# is asserted. Further,
the SDRAM keeps its on-die termination in high impedance state after RESET# deassertion until CKE is registered
HIGH. The ODT input signal may be in undefined state until tIS before CKE is registered HIGH. When CKE is
registered HIGH, the ODT input signal may be statically held at either LOW or HIGH. If RTT_NOM is to be enabled
in MR1, the ODT input signal must be statically held LOW. In all cases, the ODT input signal remains static until the
power up initialization sequence is finished, including the expiration of tDLLK and tZQinit.
5. After CKE is being registered high, wait minimum of Reset CKE Exit time, tXPR, before issuing the first MRS
command to load mode register. (tXPR=max (tXS ; 5 x tCK)
6.
Issue MRS Command to load MR2 with all application settings. (To issue MRS command for MR2, provide “Low” to
BA0 and BA2, “High” to BA1.)
7. Issue MRS Command to load MR3 with all application settings.
(To issue MRS command for MR3, provide “Low” to
BA2, “High” to BA0 and BA1.)
8. Issue MRS Command to load MR1 with all application settings and DLL enabled. (To issue "DLL Enable" command,
provide "Low" to A0, "High" to BA0 and "Low" to BA1
– BA2).


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