MC74LCX16373

http://onsemi.com

3

ORDERING INFORMATION

Device

Package

MC74LCX16373DT

TSSOP−48*

39 Units / Rail

MC74LCX16373DTG

TSSOP−48*

39 Units / Rail

MC74LCX16373DTR2

TSSOP−48*

2500 / Tape & Reel

M74LCX16373DTR2G

TSSOP−48*

2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*This package is inherently Pb−Free.

MAXIMUM RATINGS

Symbol

Parameter

Value

Condition

Unit

DC Supply Voltage

−0.5 to +7.0

V

DC Input Voltage

V

DC Output Voltage

Output in 3−State

V

Output in HIGH or LOW State. (Note 1)

V

DC Input Diode Current

−50

mA

DC Output Diode Current

−50

mA

+50

mA

DC Output Source/Sink Current

±50

mA

DC Supply Current Per Supply Pin

±100

mA

DC Ground Current Per Ground Pin

±100

mA

Storage Temperature Range

−65 to +150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Typ

Max

Unit

Supply Voltage

Operating

Data Retention Only

2.0

1.5

2.5, 3.3

2.5, 3.3

3.6

3.6

V

Input Voltage

0

5.5

V

Output Voltage

(HIGH or LOW State)

(3−State)

0

0

5.5

V

HIGH Level Output Current

− 24

− 12

− 8

mA

LOW Level Output Current

+ 24

+ 12

+ 8

mA

Operating Free−Air Temperature

−55

+125

°C

Dt/DV

0

10

ns/V