6

Mechanical

These displays are hermetically sealed for use in environ-

ments that require a high reliability device. These displays 

are  designed  and  tested  to  meet  a  helium  leak  rate  of 

These  displays  may  be  mounted  by  soldering  directly 

to a printed circuit board or insertion into a socket. The 

lead-to-lead pin spacing is 2.54 mm (0.100 inch) and the 

lead row spacing is 15.24 mm (0.600 inch). These displays 

may be end stacked with 2.54 mm (0.100 inch) spacing 

between outside pins of adjacent displays. Sockets such 

as  Augat  324-AG2D  (3  digits)  or  Augat  508-AG8D  (one 

digit, right angle mounting) may be used.

The primary thermal path for power dissipation is through 

the device leads. Therefore, to insure reliable operation 

up to an ambient temperature of +100°C, it is important 

to maintain a base-to-ambient thermal resistance of less 

than 35°C watt/device as measured on top of display pin 

3.

For  further  information  on  soldering  and  post  solder 

cleaning, see Application Note 1027, Soldering LED Com-

ponents.

Preconditioning

These  displays  are  100%  preconditioned  by  24  hour 

storage at 125°C, at 100°C for the HDSP-098x Series.

Contrast Enhancement

These  display  devices  are  designed  to  provide  an 

optimum ON/OFF contrast when placed behind an appro-

priate contrast enhancement filter. For further information 

on  contrast  enhancement,  see  Application  Note  1015, 

Contrast Enhancement for LED Displays.

Over Range Display

The over range devices display “±1” and decimal point. 

The character height and package configuration are the 

same as the numeric and hexadecimal devices. Character 

selection  is  obtained  via  external  switching  transistors 

and current limiting resistors.

Absolute Maximum Ratings

Description

Symbol

Min

Max

Unit

StorageTemperature,Ambient

–65

+125

°C

OperatingTemperature,Ambient

–55

+100

°C

ForwardCurrent,EachLED

10

mA

ReverseVoltage,EachLED

5

V