5

Intensity Bin Limit (mcd)

Blue

Iv Bin Category

Min

Max

M

5.40

8.60

N

8.60

13.70

P

13.70

21.80

Tolerance +/-15%

Note:

1. Bin categories are established for classification of products. Products

may not be available in all categories. Please contact your Avago

representative for information on currently available bins.

SMT Soldering Profile

Pb free reflow soldering Profile

245°C

TIME

6°C/SEC. MAX.

100 SEC. MAX.

60 - 120 SEC.

3°C/SEC. MAX.

3°C/SEC. MAX.

10 - 30 SEC.

150°C

200°C

217°C

(Acc. to J-STD-020C)

Notes:

1. The peak temperature refers to the peak package body temperature.

2. Number of reflow process shall be limited to maximum 2 times only.

Cooling process to normal temperature is required between first and

second soldering process.

Recommended Soldering Pattern (unit: mm)

3

2.54 x 4 = 10.16

12

2

Recommended stencil window opening is 80%