AN814

Vishay Siliconix

www.vishay.com

2

Document Number: 71237

12-Dec-03

SC-70 (6-PIN)

Room Ambient 25 _C

Elevated Ambient 60 _C

NOTE: Although they are intended for low-power applications,

devices in the 6-pin SC-70 will handle power dissipation in

excess of 0.2 W.

Testing

To aid comparison further, Figure 2 illustrates the dual-channel

SC-70 thermal performance on two different board sizes and

two different pad patterns. The results display the thermal

performance out to steady state. The measured steady state

LITTLE FOOT SC-70 (6-PIN)

1) Minimum recommended pad pattern (see

Figure 2) on the EVB of 0.5 inches x

0.6 inches.

518_C/W

2) Industry standard 1” square PCB with

maximum copper both sides.

413_C/W

Time (Secs)

FIGURE 2.

Comparison of Dual SC70-6 on EVB and 1”

Square FR4 PCB.

0

1

500

100

200

100

1000

300

10

1” Square FR4 PCB

Dual EVB

400

The results show that if the board area can be increased and

maximum copper traces are added, the thermal resistance

reduction is limited to 20%. This fact confirms that the power

dissipation is restricted with the package size and the Alloy 42

leadframe.

ASSOCIATED DOCUMENT

Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET Copper

Leadframe Version, REcommended Pad Pattern and Thermal

Performance, AN815, (http://www.vishay.com/doc?71334).