LD6836_SER

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 2 — 5 October 2012

7 of 28

NXP Semiconductors

LD6836 series

Ultra low dropout regulators, low noise, 300 mA

7.

Thermal characteristics

[1]

larger Cu layer areas for example to the power and ground layer. In multi-layer PCB applications, the second layer is used to create a

large heat spreader area directly below the LDO. If this layer is either ground or power, it is connected with several vias to the top layer

connecting to the device ground or supply. Avoid the use of solder-stop varnish under the chip.

[2]

using different layer stacks and layouts.

8.

Characteristics

Table 11.

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

thermal resistance from junction to ambient LD6836CX4, LD6836CX4/C

[1][2] 130

K/W

LD6836TD

[1][2] 125

K/W

Table 12.

Electrical characteristics

unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Output voltage

dropout voltage

[1]

LD6836CX4, LD6836CX4/C

-

90

160

mV

LD6836TD

-

100

200

mV

V

O

output voltage variation

3

0.5

+3

%

30 C  T

4-

+4

%

2

0.5

+2

%

30 C  T

3-

+3

%

Line regulation error

V

relative output voltage

variation with input voltage

[1]

0.1

-

+0.1

%/V

Load regulation error

V

relative output voltage

variation with output current

1mA

 I

-

0.0025 0.01

%/mA

Output current

current on pin OUT

-

-

300

mA

peak output current

[1]

350

-

-

mA

350

-

-

mA

short-circuit current

pin OUT

-

600

-

mA