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J-STD-020C Datasheet(PDF) 10 Page - Lite-On Technology Corporation

Part No. J-STD-020C
Description  Meet ROHS, Green Product Extra thin 0.30H mm Chip LED Extra bright A1InGaP Chip LED
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Maker  LITEON [Lite-On Technology Corporation]
Homepage  http://www.liteon.com.tw/databook/default.htm
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
Part No. : LTST-C194KSKT
Page :
10
of
11
BNS-OD-C131/A4
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward
voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.
7. Reliability Test
Classification
Test Item
Test Condition
Reference Standard
Operation Life
Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.
MIL-STD-750D:1026
MIL-STD-883D:1005
JIS C 7021:B-1
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5 ,RH= 90 95%
*Test Time= 240HRS±2HRS
MIL-STD-202F:103B
JIS C 7021:B-11
High Temperature
Storage
Ta= 105±5
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-883D:1008
JIS C 7021:B-10
Endurance
Test
Low Temperature
Storage
Ta= -55±5
*Test Time=1000HRS (-24HRS,+72H RS)
JIS C 7021:B-12
Temperature
Cycling
105
25
-55
25
30mins 5mins
30mins 5mins
10 Cycles
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1010
JIS C 7021:A-4
Thermal
Shock
IR-Reflow In-Board, 2 Times
85 ± 5
-40
± 5
10mins
10mins 10 Cycles
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1011
Solder
Resistance
T.sol= 260 ± 5
Dwell Time= 10 ± 1secs
MIL-STD-202F:210A
MIL-STD-750D:2031
JIS C 7021:A-1
IR-Reflow
Normal Process
Ramp-up rate(183
to Peak) +3 / second max
Temp. maintain at 125(±25)
120 seconds max
Temp. maintain above 183
60-150 seconds
Peak temperature range 235 +5/-0
Time within 5°C of actual Peak Temperature (tp)
10-30 seconds
Ramp-down rate +6 /second max
MIL-STD-750D:2031.2
J-STD-020C
IR-Reflow
Pb Free Process
Ramp-up rate(217
to Peak) +3 / second max
Temp. maintain at 175(±25)
180 seconds max
Temp. maintain above 217
60-150 seconds
Peak temperature range 260 +0/-5
Time within 5°C of actual Peak Temperature (tp)
20-40 seconds
Ramp-down rate +6 /second max
MIL-STD-750D:2031.2
J-STD-020C
Environmental
Test
Solderability
T.sol= 235 ± 5
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage
95% of the dipped surface
MIL-STD-202F:208D
MIL-STD-750D:2026
MIL-STD-883D:2003
IEC 68 Part 2-20
JIS C 7021:A-2
8. Others
The appearance and specifications of the product may be modified for improvement without prior notice.




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