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HSDL-9100-021 Datasheet(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED |
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HSDL-9100-021 Datasheet(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED |
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9 / 13 page  9 Recommended Reflow Profile Process Zone Symbol 'T Maximum 'T/'time or Duration Heat Up P1, R1 25°C to 150°C 3°C/s Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s Solder Reflow P3, R3 P3, R4 200°C to 260°C 260°C to 200°C 3°C/s -6°C/s Cool Down P4, R5 200°C to 25°C -6°C/s Time maintained above liquidus point , 217°C > 217°C 60s to 120s Peak Temperature 260°C - Time within 5°C of actual Peak Temperature > 255°C 20s to 40s Time 25°C to Peak Temperature 25°C to 260°C 8mins The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different 'T/'time tem- perature change rates or duration. The 'T/'time rates or duration are detailed in the above table. The tempera- tures are measured at the component to printed circuit board connections. In process zone P1, the PC board and component pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and component pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder. Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60 and 120 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the rec- ommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, putting minimal stresses on the component. It is recommended to perform reflow soldering no more than twice. 50 100 150 200 250 300 t-TIME (SECONDS) 25 80 120 150 180 200 230 255 0 R1 R2 R3 R4 R5 217 MAX 260°C 60 sec to 120 sec Above 217 °C P1 HEAT UP P2 SOLDER PASTE DRY P3 SOLDER REFLOW P4 COOL DOWN |
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