Package Matrix

Table 1–3 lists Cyclone IV E device package offerings.

Table 1–3. Package Offerings for the Cyclone IV E Device Family (1), (2)

Package

E144

M164

M256

U256

F256

F324

U484

F484

F780

Size (mm)

22 × 22

8 × 8

9 x 9

14 × 14

17 × 17

19 x 19

19 × 19

23 × 23

29 × 29

Pitch (mm)

0.5

0.5

0.5

0.8

1.0

1.0

0.8

1.0

1.0

Device

EP4CE6

91

21——

——

179

66

179

66

————

———

—

EP4CE10

91

21——

——

179

66

179

66

————

———

—

EP4CE15

81

18

89

21

165

53

165

53

165

53

————

343

137

—

—

EP4CE22

79

17——

——

153

52

153

52

————

———

—

EP4CE30

—

—

—

—

—

—

—

—

—

—

193

68

—

—

328

124

532

224

EP4CE40

—

—

—

—

—

—

—

—

—

—

193

68

328

124

328

124

532

224

EP4CE55

—

—

—

—

—

—

—

—

—

—

—

—

324

132

324

132

374

160

EP4CE75

—

—

—

—

—

—

—

—

—

—

—

—

292

110

292

110

426

178

EP4CE115

—

—

—

—

—

—

—

—

—

—

————

280

103

528

230

Notes to Table 1–3:

(1) The E144 package has an exposed pad at the bottom of the package. This exposed pad is a ground pad that must be connected to the ground plane of your PCB. Use this exposed pad for electrical

connectivity and not for thermal purposes.

(2) Use the Pin Migration View window in Pin Planner of the Quartus II software to verify the pin migration compatibility when you perform device migration. For more information, refer to the I/O

Management chapter in volume 2 of the Quartus II Handbook.

(3) This includes both dedicated and emulated LVDS pairs. For more information, refer to the I/O Features in Cyclone IV Devices chapter.