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V0402MHS03N Datasheet(PDF) 3 Page - Littelfuse |
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V0402MHS03N Datasheet(HTML) 3 Page - Littelfuse |
3 / 5 page Varistor Products ©2011 Littelfuse, Inc. Revision: November 29, 2011 MHS Varistor Series Surface Mount Multilayer Varistors (MLVs) > MHS Series Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MHS.html for current information. Lead (Pb) Soldering Recommendations The principal techniques used for the soldering of and Wave soldering. Typical profiles are shown on the right. The recommended solder for the MHS suppressor is Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. When using a reflow process, care should be taken to ensure that the MHS chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. still necessary to ensure that any further thermal shocks printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually 230 Reflow Solder Profile Wave Solder Profile Device Characteristics transient voltage suppressor approaches a linear (ohmic) relationship and shows a temperature dependent effect. At or below the maximum working voltage, the suppressor is in a high resistance model (approaching 106Ω at its maximum rated working voltage). Leakage currents at maximum rated voltage are below 100 μ μA; for 0402 size below 20 μ μA. 100% 1E-9 1E-8 SUPPRESSOR CURRENT (ADC) 10% 1E-7 1E-6 1E-5 1E-4 1E-3 1E-2 25 50 75 100 125oC o o o o Typical Temperature Dependance of the Characteristic Speed of Response The Multilayer Suppressor is a leadless device. Its response time is not limited by the parasitic lead inductances found in other surface mount packages. The response time of the Z N such as ESD. Additionally, in “real world” applications, the associated circuit wiring is often the greatest factor effecting speed of response. Therefore, transient suppressor placement within a circuit can be considered important in certain instances. GRAINS DEPLETION FIRED CERAMIC DIELECTRIC REGION METAL ELECTRODES DEPLETION REGION METAL END TERMINATION Multilayer Internal Construction Figure 5 Figure 6 Figure 7 Figure 8 |
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