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PE42851 Datasheet(PDF) 8 Page - Peregrine Semiconductor |
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PE42851 Datasheet(HTML) 8 Page - Peregrine Semiconductor |
8 / 12 page Product Specification PE42851 Page 8 of 12 ©2012-2013 Peregrine Semiconductor Corp. All rights reserved. Document No. DOC-13014-3 │ UltraCMOS® RFIC Solutions Thermal Data Though the insertion loss for this part is very low, when handling high power RF signals, the junction temperature rises significantly. VSWR conditions that present short circuit loads to the part can cause significantly more power dissipation than with proper matching. Special consideration needs to be made in the design of the PCB to properly dissipate the heat away from the part and maintain the 85°C maximum case temperature. It is recommended to use best design practices for high power QFN packages: multi-layer PCBs with thermal vias in a thermal pad soldered to the slug of the package. Special care also needs to be made to alleviate solder voiding under the part. Table 6. Theta JC Parameter Min Typ Max Unit Theta JC (+85°C) 20 C/W |
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