11

Handling and Storage

ESD (Electrostatic Discharge)

Electrostatic discharge occurs naturally in the environ-

ment. With the increase in voltage potential, the outlet of

neutralization or discharge will be sought. If the acquired

discharge route is through a semiconductor device,

destructive damage will result.

ESD countermeasure methods should be developed and

used to control potential ESD damage during handling in

a factory environment at each manufacturing site.

MSL (Moisture Sensitivity Level)

Plastic encapsulated surface mount package is sensitive to

damage induced by absorbed moisture and temperature.

Avago Technologies follows JEDEC Standard J-STD 020B.

Each component and package type is classified for

moisture sensitivity by soaking a known dry package at

Moisture Classification Level and Floor Life

MSL Level

Floor Life (out of bag) at factory ambient =< 30°C/60% RH or as stated

1

Unlimited at =< 30°C/85% RH

2

1 year

2a

4 weeks

3

168 hours

4

72 hours

5

48 hours

5a

24 hours

6

Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label

Note :

1. The MSL Level is marked on the MSL Label on each shipping bag.

various temperatures and relative humidity, and times.

After soak, the components are subjected to three con-

secutive simulated reflows.

The out of bag exposure time maximum limits are deter-

mined by the classification test describe below which cor-

responds to a MSL classification level 6 to 1 according to

the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033.

ACPM-5013 is MSL3. Thus, according to the J-STD-033

p.11 the maximum Manufacturers Exposure Time (MET)

for this part is 168 hours. After this time period, the part

would need to be removed from the reel, de-taped and

then re-baked. MSL classification reflow temperature for

the ACPM-5013 is targeted at 260°C +0/-5°C. Figure and

table on next page show typical SMT profile for maximum

temperature of 260 +0/-5°C.