ACPM-7392-TR1 datasheet(10/18 Pages) AVAGO

Part #	ACPM-7392-TR1

Description	UTMS1700/2100(1710-1755MHz) and UMTS1700(1750-1785MHz)

Download	18 Pages

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Manufacturer	AVAGO [AVAGO TECHNOLOGIES LIMITED]

Direct Link	http://www.avagotech.com

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10 / 18 page

10

PCB Design Guidelines

The recommended PCB land pattern is shown in fig-

ures on the left side. The substrate is coated with solder

mask between the I/O and conductive paddle to protect

the gold pads from short circuit that is caused by solder

bleeding/bridging.

Stencil Design Guidelines

A properly designed solder screen or stencil is required

to ensure optimum amount of solder paste is deposited

onto the PCB pads.

The recommended stencil layout is shown here. Reducing

the stencil opening can potentially generate more voids.

On the other hand, stencil openings larger than 100% will

lead to excessive solder paste smear or bridging across

the I/O pads or conductive paddle to adjacent I/O pads.

Considering the fact that solder paste thickness will di-

rectly affect the quality of the solder joint, a good choice

is to use laser cut stencil composed of 0.100mm(4mils) or

0.127mm(5mils) thick stainless steel which is capable of

producing the required fine stencil outline.

Solder Paste Stencil Aperture

Solder Mask Opening

Metallization

Ø 0.3mm

on 0.6mm pitch

0.25

0.85

0.4

0.6

0.5

0.1

0.7

0.5

0.55

0.85

2.4

1.8

0.6

0.5

1.6

2.0

0.85

0.4

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ACPM-7392-TR1 Datasheet(PDF) 10 Page - AVAGO TECHNOLOGIES LIMITED

ACPM-7392-TR1 Datasheet(HTML) 10 Page - AVAGO TECHNOLOGIES LIMITED

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