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GJB-128A Datasheet(PDF) 9 Page - Roithner LaserTechnik GmbH |
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GJB-128A Datasheet(HTML) 9 Page - Roithner LaserTechnik GmbH |
9 / 10 page 03.08.2010 eld83npt5.doc 9 of 10 7.3.3 Use anti-static containers for transport and storage. 7.3.4 Laser deterioration and damage can occur due to excessive current spikes when the power is turned on or off. Design circuits to avoid the generation of excessive current spikes. 7.3.5 Inductive surges near equipment that emits high frequency EMI can damage or destroy lasers. Avoid using lasers near fluorescent lamps or other sources of EMI emissions. 7.4 Soldering Use a grounded soldering iron to solder laser leads. Solder at a temperature of no more than 250 ℃ for a maximum of 3 seconds, at a point at least 2 mm from the base of the leads . 7.5 Handling laser diodes Never touch the glass window of the laser. A damaged or dirtied window will impair the performance of the laser. 7.6 Handling packages Due to the glass window in each device, packages must not be dropped or subjected to excessive pressure. 7.7 Safety It is extremely dangerous to look, either directly or through a lens, at the laser beam emitted from a laser diode. Use a TV camera or other similar device to adjust the optical axis. 8. Quality assurance 8.1 Laser diodes (semiconductor lasers) have a much longer life than other lasers such as gas or solid-state lasers. The components of our lasers have optimum characteristic ranges. To ensure these characteristics and product life, we manufacture our laser diodes based on comprehensive data control using our own custom manufacturing, measuring, and inspection equipment. 8.2 Quality assurance system 8.2.1 After the wafers have been manufactured, electrical and optical characteristics are measured to verify that characteristics can be achieved as the manufacturing process progresses. 8.2.2 In-process inspections are conducted at various manufacturing points to ensure the stability of our assembly operations. 8.2.3 All products are burned-in to minimize initial and random failures. 8.2.4 Characteristics of all products are tested before shipping. 8.2.5 Products are managed by wafer lot. 8.2.6 Reliability tests are performed on randomly selected samples. 8.3 Quality assurance measures 8.3.1 Materials, manufacturing conditions, and inspection are controlled and maintained based on company set standards. Temperature, dust, humidity and other environmental conditions are also controlled based on company standards. 8.3.2 Measurement instruments used during the manufacturing process are regularly inspected and calibrated based on company measurement control standards. 9. Security The laser beam emitted from a laser diode is almost invisible to both the human eye and the animal eye, however, it will injure the eye and sufficient caution must be exercised to avoid direct exposure or exposure through a fiber to the beam when a laser diode is in operation. To adjust the optical axis or perform other similar work, we recommend using an infrared-sensitive ITV camera. We also recommend that protective glasses be worn 10. Note No unauthorized transmission or reproduction of this specification, either in whole or in part, is permitted. The contents of these sheets are subject to change without notice. Always verify before use that the contents are the latest specifications. If, by any chance, a defect should arise in the equipment as a result of use without verification of the specifications, manufacturer, can bear no responsibility |
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