September 1983

Revised February 1999

© 1999 Fairchild Semiconductor Corporation

DS005341.prf

www.fairchildsemi.com

MM74HC540 • MM74HC541

Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer

General Description

The MM74HC540 and MM74HC541 3-STATE buffers uti-

lize advanced silicon-gate CMOS technology. They pos-

sess high drive current outputs which enable high speed

operation even when driving large bus capacitances.

These circuits achieve speeds comparable to low power

Schottky devices, while retaining the advantage of CMOS

circuitry, i.e., high noise immunity, and low power consump-

tion. Both devices have a fanout of 15 LS-TTL equivalent

inputs.

The

MM74HC540

is

an

inverting

buffer

and

the

MM74HC541 is a non-inverting buffer. The 3-STATE con-

trol gate operates as a two-input NOR such that if either G1

or G2 are HIGH, all eight outputs are in the high-imped-

ance state.

In order to enhance PC board layout, the MM74HC540 and

MM74HC541 offers a pinout having inputs and outputs on

opposite sides of the package. All inputs are protected from

ground.

Features

s Typical propagation delay: 12 ns

s 3-STATE outputs for connection to system buses

s Wide power supply range: 2–6V

s Low quiescent current: 80

µA maximum (74HC Series)

s Output current: 6 mA

Ordering Code:

Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Connection Diagrams

Pin Assignments for DIP, SOIC, SOP and TSSOP

Top View

MM74HC540

Top View

MM74HC541

Order Number

Package Number

Package Description

MM74HC540WM

M20B

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide

MM74HC540SJ

M20D

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

MM74HC540MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

MM74HC540N

N20A

20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide

MM74HC541WM

M20B

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide

MM74HC541SJ

M20D

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

MM74HC541MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

MM74HC541N

N20A

20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide