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MM74HC540SJ Datasheet(PDF) 1 Page - Fairchild Semiconductor |
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MM74HC540SJ Datasheet(HTML) 1 Page - Fairchild Semiconductor |
1 / 6 page September 1983 Revised February 1999 © 1999 Fairchild Semiconductor Corporation DS005341.prf www.fairchildsemi.com MM74HC540 • MM74HC541 Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer General Description The MM74HC540 and MM74HC541 3-STATE buffers uti- lize advanced silicon-gate CMOS technology. They pos- sess high drive current outputs which enable high speed operation even when driving large bus capacitances. These circuits achieve speeds comparable to low power Schottky devices, while retaining the advantage of CMOS circuitry, i.e., high noise immunity, and low power consump- tion. Both devices have a fanout of 15 LS-TTL equivalent inputs. The MM74HC540 is an inverting buffer and the MM74HC541 is a non-inverting buffer. The 3-STATE con- trol gate operates as a two-input NOR such that if either G1 or G2 are HIGH, all eight outputs are in the high-imped- ance state. In order to enhance PC board layout, the MM74HC540 and MM74HC541 offers a pinout having inputs and outputs on opposite sides of the package. All inputs are protected from damage due to static discharge by diodes to VCC and ground. Features s Typical propagation delay: 12 ns s 3-STATE outputs for connection to system buses s Wide power supply range: 2–6V s Low quiescent current: 80 µA maximum (74HC Series) s Output current: 6 mA Ordering Code: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Connection Diagrams Pin Assignments for DIP, SOIC, SOP and TSSOP Top View MM74HC540 Top View MM74HC541 Order Number Package Number Package Description MM74HC540WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide MM74HC540SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HC540MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HC540N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide MM74HC541WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide MM74HC541SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HC541MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HC541N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide |
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