TLC59282

SBVS152C

– DECEMBER 2010 – REVISED OCTOBER 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

PACKAGE-LEAD

ORDERING NUMBER

TRANSPORT MEDIA, QUANTITY

TLC59282DBQR

Tape and Reel, 2500

TLC59282

SSOP-24/QSOP-24

TLC59282DBQ

Tube, 50

TLC59282RGER

Tape and Reel, 3000

TLC59282

QFN-24

TLC59282RGE

Tape and Reel, 250

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1) (2)

Over operating free-air temperature range, unless otherwise noted.

PARAMETER

TLC59282

UNIT

Supply voltage

–0.3 to +6

V

Output current (dc)

OUT0 to OUT15

50

mA

Input voltage range

SIN, SCLK, LAT, BLANK, IREF

V

SOUT

V

Output voltage range

OUT0 to OUT15

–0.3 to +18

V

Operating junction temperature

+150

°C

Storage temperature range

–55 to +150

°C

Human body model (HBM)

4000

V

ESD rating

Charged device model (CDM)

1000

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

All voltage values are with respect to network ground terminal.

THERMAL INFORMATION

TLC59282

DBQ

RGE

UNITS

24 PINS

24 PINS

Junction-to-ambient thermal resistance

73.2

46.8

Junction-to-case (top) thermal resistance

44.6

48.6

Junction-to-board thermal resistance

38.9

23.0

°C/W

Junction-to-top characterization parameter

12.3

1.2

Junction-to-board characterization parameter

39.7

22.9

Junction-to-case (bottom) thermal resistance

n/a

6.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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Product Folder Link(s): TLC59282