Ceramic transient voltage suppressors

B72530E0350K062

SMD multilayer varistor, E series

CT1210K35G

PPD ML PD

2012-08-30

Please read Cautions and warnings and

Page 6 of 14

Important notes at the end of this document.

Recommended soldering profiles

Reflow soldering

Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D

Profile feature

Sn-Pb eutectic assembly

Pb-free assembly

Preheat and soak

- Temperature min

- Temperature max

- Time

100 °C

150 °C

60 … 120 s

150 °C

200 °C

60 … 180 s

Average ramp-up rate

3 °C/s max.

3 °C/s max.

Liquidous temperature

Time at liquidous

183 °C

60 … 150 s

217 °C

60 … 150 s

Peak package body temperature

1)

220 °C … 235 °C

2)

245 °C … 260 °C

2)

20 s

3)

30 s

3)

Average ramp-down rate

6 °C/s max.

6 °C/s max.

Time 25 °C to peak temperature

maximum 6 min

maximum 8 min

1)

2)

Depending on package thickness. For details please refer to JEDEC J-STD-020D.

3)

Note:

All temperatures refer to topside of the package, measured on the package body surface.

Number of reflow cycles: 3