NDC652P Rev. D1

-10

-8

-6

-4

-2

0

0

2

4

6

8

I

, DRAIN CURRENT (A)

T = -55°C

J

D

V

= -10V

DS

125°C

25°C

Figure 13. Transconductance Variation with Drain

Current and Temperature

Figure 16. Maximum Safe Operating Area

0

0.2

0.4

0.6

0.8

1

1

1.5

2

2.5

3

2oz COPPER MOUNTING PAD AREA (in

)

2

1c

1b

1a

4.5"x5" FR-4 Board

T

= 25 C

Still Air

V

= -4.5V

A

o

GS

0

0.2

0.4

0.6

0.8

1

0

0.5

1

1.5

2

2oz COPPER MOUNTING PAD AREA (in

)

2

1c

1b

1a

4.5"x5" FR-4 Board

T

= 25 C

Still Air

A

o

0.1

0.2

0.5

1

2

5

10

30

50

0.01

0.03

0.1

0.3

1

3

10

30

-V

, DRAIN-SOURCE VOLTAGE (V)

DS

100ms

10ms

1s

1ms

RDS(ON)

LIMIT

DC

100us

V

= -4.5V

SINGLE PULSE

R

= See Note 1c

T

= 25°C

GS

A

Figure 14. SOT-6 Maximum Steady-State Power

Dissipation versus Copper Mounting Pad Area.

Figure 15. Maximum Steady-State Drain Current

versus Copper Mounting Pad Area.

0.00001

0.0001

0.001

0.01

0.1

1

10

100

300

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t

/ t

1

2

R

(t) = r(t) * R

R

= See Note 1c

θJA

θJA

θJA

T - T

= P * R

(t)

A

J

P(pk)

Figure 17. Transient Thermal Response Curve

.

Note:

Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change

depending on the circuit board design.