NB7L72M

http://onsemi.com

5

Symbol

Characteristic

Min

Typ

Max

Unit

Maximum Input Clock Frequency

7.0

8.5

GHz

10

Gbps

(See Figures 3 and 10, Note 12)

200

400

mV

Propagation Delay to Differential Outputs,

@ 1GHz, Measured at Differential Cross−point

INn/INn to Qn/Qn

SELn to Qn/Qn

110

150

180

ps

Propagation Delay Temperature Coefficient

50

Dfs/°C

Output−to−Output Skew (within device) (Note 13)

10

20

ps

45

50

55

%

RJ – Output Random Jitter (Note 14)

DJ – Deterministic Jitter (Note 15)

v 10 Gbps

0.2

0.5

10

ps RMS

ps pk−pk

Input Voltage Swing (Differential Configuration) (Note 16)

100

1200

mV

Output Rise/Fall Times @ 1 GHz (20% − 80%),

Q, Q

25

30

50

ps

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

(20% − 80%).

12.Output voltage swing is a single−ended measurement operating in differential mode.

13.Skew is measured between outputs under identical transitions and conditions. Duty cycle skew is defined only for differential operation when

the delays are measured from cross−point of the inputs to the cross−point of the outputs.

14.Additive RMS jitter with 50% duty cycle clock signal.

15.Additive Peak−to−Peak data dependent jitter with input NRZ data at PRBS23.

16.Input voltage swing is a single−ended measurement operating in differential mode.

Figure 3. CLOCK Output Voltage Amplitude

Temperature (Typ)

fin, Clock Input Frequency (GHz)

500

450

400

350

300

200

0

1.0

2.0

3.0

4.0

5.0

6.0

7.0

8.0

Q AMP (mV)

Figure 4. Input Structure

50 W

50 W

INn

INn

250