NDM3001 Rev.C

0

0.2

0.4

0.6

0.8

1

0.5

1

1.5

2

2.5

3

3.5

2oz COPPER MOUNTING PAD AREA (in )

2

4.5"x5" FR-4 PCB

Ta = 25C

Still Air

1c

1b

1a

0.5

0.8 1

2

5

10

30

50

0.01

0.03

0.1

0.3

1

3

10

20

±V

, DRAIN-SOURCE VOLTAGE (V)

DS

1s

100ms

10s

DC

10ms

1ms

RDS(ON)

LIMIT

V

= ±10V

SINGLE PULSE

R

= See Note 1c

T

= 25°C

A

GS

Typical Thermal and Electrical Characteristics

Figure 26. P-Ch DC Drain Current Capability versus

Copper Mounting Pad Area.

0.0001

0.001

0.01

0.1

1

10

100

300

0.001

0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t

/ t

1

2

R

(t) = r(t) * R

R

= See Note 1c

θJA

θJA

θJA

T - T

= P * R

(t)

A

J

P(pk)

0

0.2

0.4

0.6

0.8

1

1.5

2

2.5

3

3.5

2oz COPPER MOUNTING PAD AREA (in

)

4.5"x5" FR-4 PCB

Ta = 25C

Still Air

Vgs = -10V

2

1c

1b

1a

Figure 25. SOIC-16 3 Leadframe Device DC Power

Dissipation versus Copper Mounting Pad Area.

Figure 28. P-Ch Typical Safe Operating Area

.

0

0.2

0.4

0.6

0.8

1

2.5

3

3.5

4

4.5

2oz COPPER MOUNTING PAD AREA (in

)

4.5"x5" FR-4 PCB

Ta = 25C

Still Air

Vgs =10V

2

1c

1b

1a

Figure 27. N-Ch DC Drain Current Capability

versus Copper Mounting Pad Area.

Figure 29. Transient Thermal Response Curve

.

Note:

Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change

depending on the circuit board design.