NDS9410S Rev.B

Figure 13. Transconductance Variation with Drain

Current and Temperature.

Figure 16. Maximum Safe Operating Area

.

0.0001

0.001

0.01

0.1

1

10

100

300

0.001

0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t /t

1

2

R

(t) = r(t) * R

R

= See note 1c

θJA

θJA

θJA

T - T

= P * R

(t)

A

J

P(pk)

0

0 .2

0 .4

0 .6

0.8

1

3

4

5

6

7

8

2oz COPPER MOUNTING PAD AREA (in

)

2

1b

1c

4.5"x5" FR-4 Board

T

= 25 C

Still Air

V

= 10V

A

o

GS

1a

0

0.2

0.4

0.6

0.8

1

0.5

1

1.5

2

2.5

2oz COPPER MOUNTING PAD AREA (in )

2

1c

1b

1a

4.5"x5" FR-4 Board

T

= 25 C

Still Air

A

o

0.1

0.2

0.5

1

2

5

10

20 30

50

0.05

0.1

0.5

1

5

10

30

50

V

, DRAIN-SOURCE VOLTAGE (V)

RDS(ON)

LIMIT

A

DC

DS

1s

100ms

10ms

10s

V

= 10V

SINGLE PULSE

R

= See Note 1c

T

= 25°C

GS

A

1ms

100µs

Figure 15. Maximum Steady- State Drain

Current versus Copper Mounting Pad

Area.

Figure 14. SO-8 Maximum Steady-State Power

Dissipation versus Copper Mounting Pad

Area.

0

5

10

15

20

25

30

0

5

10

15

20

25

I , DRAIN CURRENT (A)

T = -55°C

J

25°C

D

V

= 10V

DS

125°C

Figure 17. Transient Thermal Response Curve

.

Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change

depending on the circuit board design.