 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
NDS9410 Datasheet(PDF) 2 Page - Fairchild Semiconductor |
|
||||||||||||||||||||||||||||||
NDS9410 Datasheet(HTML) 2 Page - Fairchild Semiconductor |
|
|
2 / 8 page  NDS9410A Rev B(W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = 250 µA 30 V ∆BVDSS ∆T J Breakdown Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C 28 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V 2 µA IGSSF Gate–Body Leakage, Forward VGS = 20 V, VDS = 0 V 100 nA IGSSR Gate–Body Leakage, Reverse VGS = –20 V VDS = 0 V –100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 11.6 3 V ∆VGS(th) ∆T J Gate Threshold Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C -4.3 mV/ °C RDS(on) Static Drain–Source On–Resistance VGS = 10 V, ID = 7.3 A VGS = 10 V, ID = 7.3 A, TJ=125 °C VGS = 4.5 V, ID = 6.3 A VGS = 4.5 V, ID = 6.3 A, TJ=125 °C 19 30 25 42 28 45 42 75 m Ω ID(on) On–State Drain Current VGS = 10 V, VDS = 5 V 20 A gFS Forward Transconductance VDS = 15 V, ID = 7.3 A 22 S Dynamic Characteristics Ciss Input Capacitance 830 pF Coss Output Capacitance 185 pF Crss Reverse Transfer Capacitance VDS = 15 V, V GS = 0 V, f = 1.0 MHz 80 pF Switching Characteristics (Note 2) td(on) Turn–On Delay Time 6 12 ns tr Turn–On Rise Time 10 20 ns td(off) Turn–Off Delay Time 18 32 ns tf Turn–Off Fall Time VDD = 25 V, ID = 1 A, VGS = 10 V, RGEN = 6 Ω 510 ns Qg Total Gate Charge 14 22 nC Qgs Gate–Source Charge 2.7 nC Qgd Gate–Drain Charge VDS = 15 V, ID = 2 A, VGS = 10 V 3.0 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current 2.2 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = 2.2 A (Note 2) 0.78 1.1 V Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 50°/W when mounted on a 1in 2 pad of 2 oz copper b) 105°/W when mounted on a .04 in 2 pad of 2 oz copper c) 125°/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0% |
Similar Part No. - NDS9410 |
|
Similar Description - NDS9410 |
|
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.NET |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
