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IRF5305 Datasheet(PDF) 1 Page - Kersemi Electronic Co., Ltd. |
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IRF5305 Datasheet(HTML) 1 Page - Kersemi Electronic Co., Ltd. |
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1 / 8 page  NFT6003 / IRF5305 HEXFET® Power MOSFET Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry. Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ -10V -31 ID @ TC = 100°C Continuous Drain Current, VGS @ -10V -22 A IDM Pulsed Drain Current -110 PD @TC = 25°C Power Dissipation 110 W Linear Derating Factor 0.71 W/°C VGS Gate-to-Source Voltage ± 20 V EAS Single Pulse Avalanche Energy 280 mJ IAR Avalanche Current -16 A EAR Repetitive Avalanche Energy 11 mJ dv/dt Peak Diode Recovery dv/dt -5.0 V/ns TJ Operating Junction and -55 to + 175 TSTG Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case ) °C Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m) Absolute Maximum Ratings Parameter Typ. Max. Units RθJC Junction-to-Case ––– 1.4 RθCS Case-to-Sink, Flat, Greased Surface 0.50 ––– °C/W RθJA Junction-to-Ambient ––– 62 Thermal Resistance VDSS = -55V RDS(on) = 0.06Ω ID = -31A TO-220AB l Advanced Process Technology l Dynamic dv/dt Rating l 175°C Operating Temperature l Fast Switching l P-Channel l Fully Avalanche Rated Description S D G 1 / 8 www.kersemi.com |
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